Manufacturing process of high-frequency rack-mounted inverter

The manufacturing process of high-frequency inverters for communication is quite complicated, and directly affects the electrical functions, electromagnetic compatibility and reliability of the power supply system, and reliability is the primary indicator of the power supply of communication inverters.

The use of complete testing methods, complete process monitoring points and anti-static measures during the manufacturing process continue to a large extent the best design performance of the product, and the widespread use of SMD devices will greatly improve the reliability of welding. sex. European and American countries will require lead-free technology for electronic products from 2006, which will put forward higher and stricter requirements for the selection of components in communication power supplies and the control of the manufacturing process.

At present, the more attractive technology is the power electronics integrated module (IPEM) concept proposed by CPEC in recent years, commonly known as "building blocks." Advanced packaging technology is used to reduce parasitic factors to improve the voltage ringing and efficiency in the circuit, and the driving circuit and power devices are integrated to increase the driving speed and thus reduce the switching loss. Power electronics integration technology can not only improve transient voltage regulation, but also improve power density and system efficiency. However, such integrated modules currently have many challenges, mainly the integration of passive and active devices, and it is difficult to achieve the best thermal design. CPEC has conducted many years of research on power electronics integration technology, and has proposed many useful methods, structures and models.

The development of high-frequency inverters for communication in the direction of integration and miniaturization will be the main trend in the future. The power density will become larger and larger, and the requirements for the process will also become higher and higher. Before there are new breakthroughs in semiconductor devices and magnetic materials, major technological advances may be difficult to achieve, and the focus of technological innovation will be on how to improve efficiency and reduce weight. As a result, process technology will also occupy an increasingly higher position in power supply manufacturing. In addition, the application of digital control integrated circuits is also a direction for the development of switching power supplies in the future, which will depend on the further improvement of DSP operating speed and anti-interference technology.